Process


Reflow

THIRD STATION

REFLOW
After positioning the components in the PCB next phase is remelting through a remelting oven ERSA HOTFLOW.
PCB passes through the remelting oven, previously prepared with personalized thermal profiles for each type of electronic board. Remelting phase transforms the welding paste from “pasty” condition to the “solid” one welding permanently the components on the PCB.